iC-Haus develops and manufactures application-specific standard products (ASSPs), application-specific integrated circuits (ASiCs) and is a leading specialist for monolithic mixed-signal circuits and microsystems. Our wafer backend, chip-assembly- and test-facilities are located in Bodenheim near Frankfurt in the center of Europe. Our subcontracted wafer foundries and assemblers are situated all over the world and assure reliable, secondsourced products and deliveries. Quality engineering has been established in international standards, such as ISO9001. iC-Haus products are authorized for industrial, medical, and automotive use and follow FMEA methods and safety requirements.


Our range of technologies covers high voltage, linear bipolar, high density and analog CMOS and power BCD processes. With optional optolayers we have created OPTO-ASiCs, monolithic microsystems which have integrated sensors. Assembly is performed in standard plastic packages and for the OPTO and power ICs in the Chip-On-Board/Flex and Flip-Chip technique. Packaging can be customized, e.g. with multi-chip-modules; furthermore, the chip layout and circuit topology is tailored to customer's individual requirements, resulting in exclusive ASiCs from iC-Haus.


Our web site offers an overview of our standard integrated circuits, mainly for specific applications in the 24V environment, µP periphery, for shaft encoders, position sensors and light barriers. Please ask for samples, specifications and terms of delivery. Welcome to iC-Haus.

Product Overview
Application Guide