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iC-Haus develops and manufactures application-specific standard products (ASSPs), application-specific integrated circuits (ASiCs) and is a leading specialist for monolithic mixed-signal circuits and microsystems. Our wafer backend, chip-assembly- and test-facilities are located in Bodenheim near Frankfurt in the center of Europe. Our subcontracted wafer foundries and assemblers are situated all over the world and assure reliable, secondsourced products and deliveries. Quality engineering has been established in international standards, such as ISO9001. iC-Haus products are authorized for automotive, military and industrial use and follow FMEA methods and safety requirements.




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In 2009 iC-Haus is celebrating its 25th anniversary with a whole range of innovations.
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Bidirectional interface for digital sensors
Nuremberg, November 24-26, 2009